"Requested_prod_id","Requested_GTIN(EAN/UPC)","Requested_Icecat_id","ErrorMessage","Supplier","Prod_id","Icecat_id","GTIN(EAN/UPC)","Category","CatId","ProductFamily","ProductSeries","Model","Updated","Quality","On_Market","Product_Views","HighPic","HighPic Resolution","LowPic","Pic500x500","ThumbPic","Folder_PDF","Folder_Manual_PDF","ProductTitle","ShortDesc","ShortSummaryDescription","LongSummaryDescription","LongDesc","ProductGallery","ProductGallery Resolution","ProductGallery ExpirationDate","360","EU Energy Label","EU Product Fiche","PDF","Video/mp4","Other Multimedia","ProductMultimediaObject ExpirationDate","ReasonsToBuy","Spec 1","Spec 2","Spec 3","Spec 4","Spec 5","Spec 6","Spec 7","Spec 8" "","","342023","","Lenovo","73P3525","342023","","Memory Modules","911","","","1 GB PC2-3200 (2x512MB) ECC DDR2 SDRAM DIMM Kit","20240307153452","ICECAT","","14667","https://images.icecat.biz/img/norm/high/336342-6281.jpg","293x200","https://images.icecat.biz/img/norm/low/336342-6281.jpg","https://images.icecat.biz/img/gallery_mediums/img_336342_medium_1480938264_3348_26422.jpg","https://images.icecat.biz/thumbs/336342.jpg","","","Lenovo 1 GB PC2-3200 (2x512MB) ECC DDR2 SDRAM DIMM Kit memory module 400 MHz","1 GB PC2-3200 (2x512MB) ECC DDR2 SDRAM DIMM Kit","Lenovo 1 GB PC2-3200 (2x512MB) ECC DDR2 SDRAM DIMM Kit, 1 GB, DDR2, 400 MHz","Lenovo 1 GB PC2-3200 (2x512MB) ECC DDR2 SDRAM DIMM Kit. Internal memory: 1 GB, Internal memory type: DDR2, Memory clock speed: 400 MHz, ECC","This new dual-channel DDR2 memory option unleashes the power of the Intel® Processor with its 800MHz front-side bus speed by matching the processor front-side bus bandwidth of 6.4GB with an equal, balanced 6.4GB of memory bandwidth. In combination with the CPU and chipset, system memory is one of the key contributors to overall system performance. This new memory offering is also known as DDR400 memory and it is the highest performing memory architecture available in the Intel® server/workstation market. One of the key features of this new memory advance is the FBGA (Fine Pitch Ball Grid Array) packaging technology which allows for a slim module design, therefore, increasing the air flow space between the memory module and the circuit board. This increased air flow equates to improved system thermal performance and reliability. These technology advances result in a balanced xSeries system/IntelliStation workstation platform which is optimized for memory demanding applications, such as MCAD, Electronic Design Automation, Digital Content Creation and Life Sciences.\r\n \r\n Features & Benefits: \r\n \r\n• · These new memory offerings are available in kits of two 256MB, 512MB and 1GB capacities \r\n• · Higher peak bandwidth/transfer rates for increased performance delivers 20% higher peak bandwidth than DDR memory \r\n• · Lower power consumption and better thermal characteristics. The 1.8v operational power delivers a 50% power reduction compared to DDR memory \r\n• · Up to four DIMMs per channel compared to three DIMMs with DDR, resulting in a 25% improvement compared to DDR memory.","https://images.icecat.biz/img/norm/high/336342-6281.jpg","293x200","","","","","","","","","","Features","Internal memory: 1 GB","Internal memory type: DDR2","Memory clock speed: 400 MHz","ECC: Yes","Lead plating: Gold","Other features","Number of pins: 240"