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Short summary description HP DL380 G7 X5690 FIO KIT prosesor 3,06 GHz 12 MB L3 Baki:
HP DL380 G7 X5690 FIO KIT, Intel® Xeon® 5000 Sequence, Socket B (LGA 1366), 32 nm, Baki, X5675, 3,06 GHz
Long summary description HP DL380 G7 X5690 FIO KIT prosesor 3,06 GHz 12 MB L3 Baki:
HP DL380 G7 X5690 FIO KIT. Keluarga prosesor: Intel® Xeon® 5000 Sequence, Soket prosesor: Socket B (LGA 1366), Litografi prosesor: 32 nm. Kanal memori: Triple-channel, Memori internal maksimal yang didukung oleh prosesor: 288 GB, Kecepatan jam memori didukung oleh prosesor: 800,1066,1333 MHz. Segmen pasar: Server. Temperatur (maks): 81,3 °C
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